Ran part of the quals for recipe #3, as per wiki procedures.
Thermal oxide etch rate = 353 A/min
Within wafer nonuniformity = 4.1%
Across the load total nonuniformity = 4.4%
Resist etch rate = 67 A/min
More to come.
Thursday, January 20, 2011
Subscribe to:
Post Comments (Atom)
No comments:
Post a Comment